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TA7291P/S/SG/F/FG
TOSHIBA BIPOLAR LINEAR INTEGRATED CIRCUIT SILICON MONOLITHIC
TA7291P, TA7291S/SG, TA7291F/FG
BRIDGE DRIVER
The TA7291P / S/SG / F/FG are Bridge Driver with output voltage control.
FEATURES
4 modes available (CW / CCW / STOP / BRAKE) Output current: P type 1.0 A (AVE.) 2.0 A (PEAK) S/SG,/ F/FG type 0.4 A (AVE.) 1.2 A (PEAK) Wide range of operating voltage: VCC (opr.) = 4.5~20 V VS (opr.) = 0~20 V *Please consider the internal loss (Vsat) to operate the IC though minimum VS is defined zero. Vref (opr.) = 0~20 V Build in thermal shutdown, over current protector and punch = through current restriction circuit. Stand-by mode available (STOP MODE) Hysteresis for all inputs.
TA7291F/FG TA7291S/SG
TA7291P, TA7291SG/FG: TA7291P Sn plated product including Pb. TA7291SG/FG is Pb free product. The following conditions apply to solderability: *Solderability 1. Use of Sn-37Pb solder bath *solder bath temperature=230 degrees *dipping time=5seconds *number of times=once *use of R-type flux 2. Use of Sn-3.0Ag-0.5Cu solder bath *solder bath temperature=245 degrees *dipping time=5seconds *the number of times=once *use of R-type flux
Weight HSIP10-P-2.54 : 2.47 g (Typ.) SIP9-P-2.54A : 0.92 g (Typ.) HSOP16-P-300-1.00 : 0.50 g (Typ.)
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TA7291P/S/SG/F/FG
BLOCK DIAGRAM
TA7291P / TA7291S/SG / TA7291F/FG
PIN FUNCTION
P 7 8 4 1 5 6 2 10 PIN No. S/SG 2 6 8 5 9 1 7 3 F/FG 11 15 5 1 7 9 4 13 SYMBOL VCC VS Vref GND IN1 IN2 OUT1 OUT2 FUNCTION DESCRIPTION Supply voltage terminal for Logic Supply voltage terminal for Motor driver Supply voltage terminal for control GND terminal Input terminal Input terminal Output terminal Output terminal
P Type: Pin (3), (9): NC S/SG Type: PIN (4): NC F/FG Type: PIN (2), (3), (6), (8), (10), (12), (14), and (16): NC For F/FG Type, We recommend FIN to be connected to the GND.
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FUNCTION
INPUT IN1 0 1 0 1 IN2 0 0 1 1 OUT1 H L L OUTPUT OUT2 L H L MODE STOP CW / CCW CCW / CW BRAKE
: Note:
High impedance Inputs are all high active type
ABSOLUTE MAXIMUM RATINGS (Ta = 25C)
CHARACTERISTIC Supply Voltage Motor Drive Voltage Reference Voltage PEAK Output Current AVE. P Type S/SG, F/FG Type P Type S/SG, F/FG Type P Type Power Dissipation S/SG Type F/FG Type Operating Temperature Storage Temperature Topr Tstg PD SYMBOL VCC VS Vref IO (PEAK) RATING 25 25 25 2.0 1.2 1.0 0.4 12.5 (Note 1) 0.95 (Note 2) 1.4 (Note 3) -30~75 -55~150 C C W A UNIT V V V
IO (AVE.)
Note 1: Tc = 25C (TA7291P/PG) Note 2: No heat sink Note 3: PCB (60 x 30 x 1.6 mm, occupied copper area in excess of 50%) Mounting Condition. Wide range of operating voltage: VCC (opr.) = 4.5~20 V VS (opr.) = 0~20 V Vref (opr.) = 0~20 V Vref VS
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ELECTRICAL CHARACTERISTICS
(Unless otherwise specified, Ta = 25C, VCC = 12 V, VS = 18 V)
CHARACTERISTIC SYMBOL ICC1 Supply Current ICC2 ICC3 Input Operating Voltage Input Current Input Hysteresis Voltage P/ S/SG / F/FG Type Upper Side Lower Side Upper Side Lower Side Upper Side P Type Lower Side 1 (High) 2 (Low) VIN1 VIN2 IIN VT VSAT U-1 VSAT L-1 VSAT U-2 3 VSAT L-2 VSAT U-3 VSAT L-3 2 1 TEST CIR- CUIT TEST CONDITION Output OFF, CW / CCW mode Output OFF, Stop mode Output OFF, Brake mode Tj = 25C VIN = 3.5 V, Sink mode Vref = VS, VOUT - VS measure IO = 0.2 A, CW / CCW mode Vref = VS, VOUT - GND measure IO = 0.2 A, CW / CCW mode Vref = VS, VOUT - VS measure IO = 0.4 A, CW / CCW mode Vref = VS, VOUT - GND measure IO = 0.4 A, CW / CCW mode Vref = VS, VOUT - VS measure IO = 1.0 A, CW / CCW mode Vref = VS, VOUT - GND measure IO = 1.0 A, CW / CCW mode Vref = 10 V VOUT - GND measure, IO = 0.2 A, CW / CCW mode Vref = 10 V VOUT - GND measure, IO = 0.4 A, CW / CCW mode Vref = 10 V VOUT - GND measure, IO = 0.5 A, CW / CCW mode Vref = 10 V VOUT - GND measure, IO = 1.0 A, CW / CCW mode VL = 25 V 4 IL L VF U-1 VF U-2 5 VF L-1 VF L-2 Iref 2 IF = 0.4 A IF = 1 A Vref = 10 V, Source mode 0.9 VL = 25 V IF = 0.4 A IF = 1 A 50 MIN 3.5 GND TYP. 8.0 0 6.5 3 0.7 0.9 MAX 13.0 50 10.0 5.5 0.8 10 1.2 UNIT mA A mA V A V
0.8
1.2
Saturation Voltage
S/SG / F/FG Type
1.0
1.35 V
0.9
1.35
1.3
1.8
1.2
1.85
VSAT U-1' S/SG / F/FG Type Output Voltage (Upper Side) P Type VSAT U-4' Upper Side Lower Side S/SG / F/FG Type Diode Forward Voltage P Type S/SG / F/FG Type P Type Reference Current Upper Side Lower Side Upper Side Lower Side IL U VSAT U-2' 3 VSAT U-3'
11.2
10.4
10.9
12.2 V
11.0
10.2
10.7
12.0
50 A
Leakage Current
1.5
2.5
V

1.2 20
40 A
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TA7291P/S/SG/F/FG
TEST CIRCUIT 1
ICC1, ICC2, ICC3
TA7291P /S/SG /F/FG
Note:
HEAT FIN of TA7291F/FG is connected to GND.
TEST CIRCUIT 2
VIN 1, VIN 2, IIN , VT, Iref
TA7291P /S/SG /F/FG
TA7291P / TA7291S/SG / TA7291F/FG
Note:
HEAT FIN of TA7291F/FG is connected to GND.
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TEST CIRCUIT 3
VSAT U-1, 2, 3 VSAT L-1, 2, 3 VSAT U-1', 2', 3', 4'
TA7291P/S/SG /F/FG
Note: Note:
IOUT calibration is required to adjust specified values of test conditions by RL. (IOUT = 0.2 A / 0.4 A / 0.5 A / 1.0 A) HEAT FIN of TA7291F/FG is connected to GND.
TEST CIRCUIT 4
IL U, L
TA7291P /S/SG /F/FG
TA7291P / TA7291S/SG / TA7291F/FG
Note:
HEAT FIN of TA7291F/FG is connected to GND.
TEST CIRCUIT 5
VF U-1, 2 VF L-1, 2
TA7291P /S/SG /F/FG
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TA7291P TA7291P
TA7291S/SG
TA7291S/SG
TA7291F/FG
TA7291F/FG
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TA7291P/S/SG/F/FG
TA7291P TA7291P
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NOTES
Input circuit
Input Terminals of pin (5) and (6) (TA7291P) are all high active type and have a hysteresis of 0.7 V (typ.), 3 A (typ.) of source mode input current is required.
TA7291P /TA7291S/SG /TA7291F/FG
Output circuit
Output voltage is controlled by Vref voltage. Relationship between VOUT and Vref is VOUT = VBE ( 0.7) + Vref Vref terminal required to connect to VS terminal for stable operation in case of no requirement of VOUT control. Vref VS
TA7291P /TA7291S/SG /TA7291F/FG
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APPLICATION CIRCUIT
TA7291P /S/SG /F/FG
TA7291P /TA7291S/SG /TA7291F/FG
Note 1: Experiment to find the optimum capacitor valve. Note 2: To protect against excess current, current limitation resistor R should be inserted where necessary.
NOTES
Be careful when switching the input because rush current may occur. When switching, stop mode should be entered or current limitation resister R should be inserted. The IC functions cannot be guaranteed when turning power on of off. Before using the IC for application, check that there are no problems. Utmost care is necessary in the design of the output, VCC, VM, and GND lines since the IC may be destroyed by short-circuiting between outputs, air contamination faults, or faults due to improper grounding, or by short-circuiting between contiguous pins.
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PACKAGE DIMENSIONS
HSIP10-P-2.54 Unit: mm
Weight: 2.47 g (Typ.)
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TA7291P/S/SG/F/FG
PACKAGE DIMENSIONS
SIP9-P-2.54A Unit: mm
Weight: 0.92 g (Typ.)
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TA7291P/S/SG/F/FG
PACKAGE DIMENSIONS
HSOP16-P-300-1.00 Unit: mm
Weight: 0.50 g (Typ.)
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TA7291P/S/SG/F/FG
Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. Timing charts may be simplified for explanatory purposes. The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment.
2. Equivalent Circuits
3. Timing Charts
4. Application Circuits
5. Test Circuits
IC Usage Considerations
Notes on handling of ICs
[1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. [2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. [3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. [4] Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time.
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Points to remember on handling of ICs
(1) Over current Protection Circuit Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all circumstances. If the Over current protection circuits operate against the over current, clear the over current status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the over current protection circuit to not operate properly or IC breakdown before operation. In addition, depending on the method of use and usage conditions, if over current continues to flow for a long time after operation, the IC may generate heat resulting in breakdown. (2) Thermal Shutdown Circuit Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal shutdown circuits operate against the over temperature, clear the heat generation status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit to not operate properly or IC breakdown before operation. (3) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (TJ) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. (4) Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor's power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device's motor power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design.
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RESTRICTIONS ON PRODUCT USE
* The information contained herein is subject to change without notice. 021023_D
070122EBA_R6
* TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc. 021023_A * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. 021023_B * The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. 070122_C * Please use this product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 060819_AF * The products described in this document are subject to foreign exchange and foreign trade control laws. 060925_E
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